In terms of bonding wire development and analysis capability, MEM does has in-house facilities that enable us to perform various analytical processes internally.

Analysis Equipment

Electron Pobe Micro-Analyzer for Surface examination of alloy or oxidation, and IMC behaviour after bonding due to aging
Focused Ion Beam system for Grain structure analysis, and IMC behaviour after bonding due to aging
Field Emission Transmission Electron Microscope for Grain structure analysis, and IMC behaviour after bonding due to aging
Scanning Auger Electron Microscope for Surface examination of alloy or oxidation, and IMC behaviour after bonding due to aging
X-Ray Photoelectron Spectrometry for Surface analysis
X-Ray Diffract meter for Grain structure analysis, and IMC behaviour after bonding due to aging