New addition to the MEM product family now includes the MCX Sumitomo Cu alloy wire. The MCX series offer high reliability, excellent 2nd bond bondability and less pad damage compare to some other types of Cu wire.

The MCX copper wire has soft FAB (Free Air Ball), offering less possibility of pad damage on the chip and allowing better performance in bonding process reliability.

For small FAB size, the MCX gives excellent ball consistency among Cu wire.

 

 

 

 

With good optimization, the MCX copper bonding wire can reduce Al splash to the minimum.  

MCX copper bonding wire has high stitch pull strength among Cu bonding wires  

The MCX yields very good performance during u-HAST (unbiased Highly-Accelerated temperature and humidity Stress Test), as can be seen in the test result chart below for 18 microns wires.

Bare Cu wire performance begins to deteriorate after 192 hours of u-HAST, while the MCX wire continues to show no degradation at the 1008 hours mark. The MCX has demonstrated higher reliability than the conventional 4N Cu in PBGA package applications.

The MCX wire has good performance in low pH condition, such as in the event of acid decapsulation process  

MCX - the solution for enhancing reliability and bondability in Fine Pitch application.